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ICCAD
2006
IEEE
124views Hardware» more  ICCAD 2006»
16 years 3 months ago
Simultaneous power and thermal integrity driven via stapling in 3D ICs
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...
Hao Yu, Joanna Ho, Lei He
IV
2008
IEEE
155views Visualization» more  IV 2008»
16 years 1 months ago
Visualise Undrawable Euler Diagrams
Given a group of overlapping sets, it is not always possible to represent it with Euler diagrams. Euler diagram characteristics might collide with the sets relationships to depict...
Paolo Simonetto, David Auber
HICSS
2007
IEEE
115views Biometrics» more  HICSS 2007»
16 years 1 months ago
Multiplex conversations afforded by technology
This article presents results from a small-scale pilot study investigating linguistic production and structural patterns while multitasking and interrelating these findings with c...
Therese Ornberg Berglund
ICALT
2006
IEEE
16 years 27 days ago
Tuning IMS LD for Implementing a Collaborative Lifelong Learning Scenario
This paper describes an approach for modeling and implementing a collaborative learning situation, which is part of a real lifelong learning scenario in astronomy. We adopt and sl...
Davinia Hernández Leo, Eloy D. Villasclaras...
179
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ISNN
2005
Springer
16 years 10 days ago
A Novel Solid Neuron-Network Chip Based on Both Biological and Artificial Neural Network Theories
Built on the theories of biological neural network, artificial neural network methods have shown many significant advantages. However, the memory space in an artificial neural chip...
Zihong Liu, Zhihua Wang, Guolin Li, Zhiping Yu