Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...
- Redundant via insertion and line end extension employed in the post-routing stage are two well known and highly recommended techniques to reduce yield loss due to via failure. Ho...
Process variations in modern VLSI technologies are growing in both magnitude and dimensionality. To assess performance variability, complex simulation and performance models param...