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ICCAD
2004
IEEE
138views Hardware» more  ICCAD 2004»
16 years 3 months ago
A thermal-driven floorplanning algorithm for 3D ICs
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
Jason Cong, Jie Wei, Yan Zhang
ICCAD
2003
IEEE
166views Hardware» more  ICCAD 2003»
16 years 3 months ago
Fault-Tolerant Techniques for Ambient Intelligent Distributed Systems
Ambient Intelligent Systems provide an unexplored hardware platform for executing distributed applications under strict energy constraints. These systems must respond quickly to c...
Diana Marculescu, Nicholas H. Zamora, Phillip Stan...
ICCAD
2002
IEEE
73views Hardware» more  ICCAD 2002»
16 years 3 months ago
Shaping interconnect for uniform current density
As the VLSI technology scaling down, the electromigration problem becomes one of the major concerns in high-performance IC design for both power network and signal interconnects. ...
Muzhou Shao, D. F. Wong, Youxin Gao, Li-Pen Yuan, ...
ICCAD
2002
IEEE
113views Hardware» more  ICCAD 2002»
16 years 3 months ago
Interconnect-aware high-level synthesis for low power
Abstract—Interconnects (wires, buffers, clock distribution networks, multiplexers and busses) consume a significant fraction of total circuit power. In this work, we demonstrat...
Lin Zhong, Niraj K. Jha
ICCAD
2001
IEEE
127views Hardware» more  ICCAD 2001»
16 years 3 months ago
What is the Limit of Energy Saving by Dynamic Voltage Scaling?
Dynamic voltage scaling (DVS) is a technique that varies the supply voltage and clock frequency based on the computation load to provide desired performance with the minimal amoun...
Gang Qu
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