Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Partial reconfiguration (PR) reveals many opportunities for integration into FPGA design for potential system optimizations such as reduced area, increased performance, and increa...
In this paper, an object-oriented unified optimization framework (UOF) for general problem optimization is proposed. Based on evolutionary algorithms, numerical deterministic meth...
We present the design of a banner advertising auction which is considerably more expressive than current designs. We describe a general model of expressive ad contracts/bidding an...
Craig Boutilier, David C. Parkes, Tuomas Sandholm,...
We present a mathematical framework for the so-called multidisciplinary free material optimization (MDFMO) problems, a branch of structural optimization in which the full material ...