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SLIP
2009
ACM
16 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ERSA
2008
185views Hardware» more  ERSA 2008»
15 years 8 months ago
Design Framework for Partial Run-Time FPGA Reconfiguration
Partial reconfiguration (PR) reveals many opportunities for integration into FPGA design for potential system optimizations such as reduced area, increased performance, and increa...
Chris Conger, Ann Gordon-Ross, Alan D. George
GECCO
2006
Springer
137views Optimization» more  GECCO 2006»
15 years 10 months ago
A unified optimization framework for microelectronics industry
In this paper, an object-oriented unified optimization framework (UOF) for general problem optimization is proposed. Based on evolutionary algorithms, numerical deterministic meth...
Yiming Li, Cheng-Kai Chen, Yen-Yu Cho
AAAI
2008
15 years 9 months ago
Expressive Banner Ad Auctions and Model-Based Online Optimization for Clearing
We present the design of a banner advertising auction which is considerably more expressive than current designs. We describe a general model of expressive ad contracts/bidding an...
Craig Boutilier, David C. Parkes, Tuomas Sandholm,...
SIAMAM
2010
84views more  SIAMAM 2010»
15 years 5 months ago
Multidisciplinary Free Material Optimization
We present a mathematical framework for the so-called multidisciplinary free material optimization (MDFMO) problems, a branch of structural optimization in which the full material ...
Jaroslav Haslinger, Michal Kocvara, Günter Le...