10533 search results - page 271 / 2107 » Design in reliability for communication designs |
126
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HCI
2007
15 years 8 months ago
2007
We discuss the privacy issues related to the design of systems that disclose information about emotions to remote acquaintances, without simultaneous communication: users do not ch...
186
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ISPD
2010
ACM
16 years 1 months ago
2010
ACM
Thermal/power issues have become increasingly important with more and more transistors being put on a single chip. Many dynamic thermal/power management techniques have been propo...
142
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DSD
2009
IEEE
16 years 1 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
140
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KDD
2003
ACM
16 years 7 months ago
2003
ACM
Data mining techniques are routinely used by fundraisers to select those prospects from a large pool of candidates who are most likely to make a financial contribution. These tech...
155
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ICCAD
2003
IEEE
16 years 3 months ago
2003
IEEE
Ultra-deep submicron manufacturability impacts physical design (PD) through complex layout rules and large guardbands for process variability; this creates new requirements for ne...