Abstract--Cluster tools are widely used as semiconductor manufacturing equipment. While throughput analysis and scheduling of single-cluster tools have been well-studied, research ...
Jingang Yi, Shengwei Ding, Dezhen Song, Mike Tao Z...
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
With increasing design complexity, as well as continued scaling of supplies, the design and analysis of power/ground distribution networks poses a difficult problem in modern IC d...
Background: The general problem of RNA secondary structure prediction under the widely used thermodynamic model is known to be NP-complete when the structures considered include a...