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SLIP
2009
ACM
16 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
ACMDIS
2008
ACM
15 years 8 months ago
Exploring true multi-user multimodal interaction over a digital table
True multi-user, multimodal interaction over a digital table lets co-located people simultaneously gesture and speak commands to control an application. We explore this design spa...
Edward Tse, Saul Greenberg, Chia Shen, Clifton For...
IIS
2000
15 years 8 months ago
Speeding Up Evolution through Learning: LEM
This paper reports briefly on the development of a new approach to evolutionary computation, called the Learnable Evolution Model or LEM. In contrast to conventional Darwinian-typ...
Ryszard S. Michalski, Guido Cervone, Kenneth A. Ka...
SG
2010
Springer
15 years 4 months ago
An Interactive Interface for Lighting-by-Example
Lighting design in computer graphics is essentially not a random process but one driven by both a technical and aesthetic appreciation of lighting. In some applications, the result...
Hai Nam Ha, Christophe Lino, Marc Christie, Patric...
PUC
2011
15 years 1 months ago
Shape-changing interfaces
The design of physical interfaces has been constrained by the relative akinesis of the material world. Current advances in materials science promise to change this. In this paper, ...
Marcelo Coelho, Jamie Zigelbaum