28095 search results - page 295 / 5619 » D |
158
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CVPR
2010
IEEE
16 years 2 months ago
2010
IEEE
We describe a method for 3D object scanning by aligning depth scans that were taken from around an object with a time-of-flight camera. These ToF cameras can measure depth scans ...
198
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CVPR
2010
IEEE
16 years 2 months ago
2010
IEEE
A framework is presented for estimating the pose of a camera based on images extracted from a single omnidirectional image of an urban scene, given a 2D map with building outlines...
170
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SC
2009
ACM
16 years 1 months ago
2009
ACM
The scalability of future massively parallel processing (MPP) systems is being severely challenged by high failure rates. Current hard disk drive (HDD) checkpointing results in ov...
176
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
— Technology scaling has caused the feature sizes to shrink continuously, whereas interconnects, unlike transistors, have not followed the same trend. Designing 3D stack architec...
161
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...