28095 search results - page 253 / 5619 » D |
165
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MICRO
2006
IEEE
16 years 21 days ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
186
Voted
WACV
2005
IEEE
16 years 7 days ago
2005
IEEE
The performance of face recognition systems that use two-dimensional images depends on consistent conditions w.r.t. lighting, pose, and facial appearance. We are developing a face...
184
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GRAPHITE
2005
ACM
16 years 7 days ago
2005
ACM
Linear perspective is a good approximation to the format in which the human visual system conveys 3D scene information to the brain. Artists expressing 3D scenes, however, create ...
243
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RT
2005
Springer
16 years 5 days ago
2005
Springer
3D Face modeling is still one of the biggest challenges in computer graphics. In this paper we present a novel framework that acquires the 3D shape, texture, pose and illumination...
177
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ASPDAC
2004
ACM
16 years 3 days ago
2004
ACM
— We have developed the first real-time 3-D image sensor with VGA pixel resolution using mixed-signal techniques to achieve high-speed and high-accuracy range calculation based ...