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DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
CVPR
2009
IEEE
17 years 1 months ago
Human Motion Synthesis from 3D Video
Multiple view 3D video reconstruction of actor performance captures a level-of-detail for body and clothing movement which is time-consuming to produce using existing animation ...
Peng Huang (University of Surrey), Adrian Hilton (...
ICCV
2009
IEEE
16 years 11 months ago
Poselets: Body Part Detectors Trained Using 3D Human Pose Annotations
We address the classic problems of detection, segmenta- tion and pose estimation of people in images with a novel definition of a part, a poselet. We postulate two criteria (1) ...
Lubomir Bourdev, Jitendra Malik
ECCV
2008
Springer
16 years 8 months ago
Simultaneous Detection and Registration for Ileo-Cecal Valve Detection in 3D CT Colonography
Object detection and recognition has achieved a significant progress in recent years. However robust 3D object detection and segmentation in noisy 3D data volumes remains a challen...
Le Lu, Adrian Barbu, Matthias Wolf, Jianming Liang...
ECCV
2006
Springer
16 years 8 months ago
The Alignment Between 3-D Data and Articulated Shapes with Bending Surfaces
In this paper we address the problem of aligning 3-D data with articulated shapes. This problem resides at the core of many motion tracking methods with applications in human motio...
Guillaume Dewaele, Frederic Devernay, Radu Horaud,...