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168
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ICCAD
2010
IEEE
15 years 4 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
235
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ICIP
2010
IEEE
15 years 4 months ago
2010
IEEE
Osteoporosis is a bone disease characterized by a reduction in bone mass, resulting in an increased risk of fractures. To diagnose the osteoporosis accurately, bone mineral densit...
183
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ICIP
2010
IEEE
15 years 4 months ago
2010
IEEE
When comparing 2D shapes, a key issue is their normalization. Translation and scale are easily taken care of by removing the mean and normalizing the energy. However, defining and...
162
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ICPR
2010
IEEE
15 years 4 months ago
2010
IEEE
3D face recognition exploits shape information as well as texture information in 2D systems. The use of whole 3D face is sensitive to some undesired situations like expression var...
213
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GLVLSI
2009
IEEE
15 years 4 months ago
2009
IEEE
Distributing power and ground to a vertically integrated system is a complex and difficult task. Interplane communication and power delivery are achieved by through silicon vias (...