— In three-dimensional (3D) chips, the amount of supply current per package pin is significantly more than in two-dimensional (2D) designs. Therefore, the power supply noise pro...
Pingqiang Zhou, Karthikk Sridharan, Sachin S. Sapa...
A number of geometric active contour and surface models have been proposed for shape segmentation in the literature. The essential idea is to evolve a curve (in 2D) or a surface (i...
For virtual reality systems, modeling of 3D objects and scenes is important and challenging. In this paper, we present an image-based interactive 3D modeling framework consisting ...
We present new parallel algorithms for 3D reconstruction of objects from 2D projections and their application for the determination of the structure of macromolecules from electro...
Robert E. Lynch, Dan C. Marinescu, Hong Lin, Timot...
Although PC-class 3D graphics hardware has made significant strides in the last several years, the underlying architectural design principles are still generally considered as a b...