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SLIP
2009
ACM
16 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
FGR
2008
IEEE
197views Biometrics» more  FGR 2008»
16 years 1 months ago
Robust real-time 3D time-of-flight based gesture navigation
: Contactless Human-Machine-Interfaces (HMIs) are an important issue in various applications where a haptic interaction with an input device is not possible or not appropriate. New...
Jochen Penne, Stefan Soutschek, Lukas Fedorowicz, ...
ICPR
2008
IEEE
16 years 1 months ago
Dyslexia diagnostics by 3D texture analysis of cerebral white matter gyrifications
The importance of accurate early diagnostics of dyslexia that severely affects the learning abilities of children cannot be overstated. Neuropathological studies have revealed an ...
Ayman El-Baz, Manuel Casanova, Georgy L. Gimel'far...
ICPR
2008
IEEE
16 years 1 months ago
Human detection by searching in 3d space using camera and scene knowledge
Many existing human detection systems are based on sub-window classification, namely detection is done by enumerating rectangular sub-images in the 2D image space. Detection rate...
Yuan Li, Bo Wu, Ram Nevatia
ISM
2008
IEEE
93views Multimedia» more  ISM 2008»
16 years 1 months ago
Analytical Model for Mesh-Based P2PVoD
Recently, there has been a growing interest in academic and commercial environments for Video-on-Demand (VoD) using Peer-to-Peer (P2P) technology. Unlike centralized solutions for...
Yue Lu, Jan David Mol, Fernando A. Kuipers, Piet V...