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153
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
182
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ICASSP
2009
IEEE
16 years 1 months ago
2009
IEEE
The three-dimensional discrete cosine transform (3D DCT) has been proposed as an alternative to motion-compensated transform coding for video content. However, so far no definiti...
147
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ICRA
2009
IEEE
16 years 1 months ago
2009
IEEE
— We report our first experiences with Leaving Flatland, an exploratory project that studies the key challenges of closing the loop between autonomous perception and action on c...
166
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ICB
2009
Springer
16 years 1 months ago
2009
Springer
This paper presents a technique for decomposing an unseen 3D face under any facial expression into an estimated 3D neutral face and expression deformations (the shape residue betwe...
143
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ASPDAC
2009
ACM
16 years 1 months ago
2009
ACM
— 1In this paper, we will present a placement method for analog circuits. We consider both common centroid and 1-D symmetry constraints, which are the two most common types of pl...