: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
This paper presents a new interaction technique for browsing large visual information bases in a collaborative environment. The ATELIER project deals with learning environments fo...
Existing languages provide good support for typeful programming of standalone programs. In a distributed system, however, there may be interaction between multiple instances of ma...
Peter Sewell, James J. Leifer, Keith Wansbrough, F...
System-on-Chip (SOC) and other complex distributed hardware/software systems contain heterogeneous components such as DSPs, micro-controllers, application specific logic etc., whi...
Deepak Mathaikutty, Hiren D. Patel, Sandeep K. Shu...
- One of the critical issues in MTCMOS design is how to estimate a circuit delay quickly. In this paper, we propose a delay modeling and static timing analysis (STA) methodology ta...