1617 search results - page 277 / 324 » Constraints in Weighted Averaging |
174
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ISCA
2009
IEEE
16 years 23 days ago
2009
IEEE
Industry has shifted towards multi-core designs as we have hit the memory and power walls. However, single thread performance remains of paramount importance since some applicatio...
177
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ASPDAC
2009
ACM
16 years 19 days ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
158
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MICRO
2006
IEEE
16 years 4 days ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
159
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CF
2004
ACM
15 years 11 months ago
2004
ACM
Current instruction fetch policies in SMT processors are oriented towards optimization of overall throughput and/or fairness. However, they provide no control over how individual ...
161
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IPSN
2004
Springer
15 years 11 months ago
2004
Springer
Due to constraints in cost, power, and communication, losses often arise in large sensor networks. The sensor can be modeled as an output of a linear stochastic system with random...