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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICCAD
2003
IEEE
219views Hardware» more  ICCAD 2003»
16 years 3 months ago
A Min-Cost Flow Based Detailed Router for FPGAs
Routing for FPGAs has been a very challenging problem due to the limitation of routing resources. Although the FPGA routing problem has been researched extensively, most algorithm...
Seokjin Lee, Yongseok Cheon, Martin D. F. Wong
CVPR
2010
IEEE
16 years 3 months ago
Recovering Fluid-type Motions Using Navier-Stokes Potential Flow
The classical optical flow assumes that a feature point maintains constant brightness across the frames. For fluidtype motions such as smoke or clouds, the constant brightness ass...
Feng Li, Liwei Xu, Philippe Guyenne, Jingyi Yu
IPSN
2010
Springer
16 years 1 months ago
Online distributed sensor selection
A key problem in sensor networks is to decide which sensors to query when, in order to obtain the most useful information (e.g., for performing accurate prediction), subject to co...
Daniel Golovin, Matthew Faulkner, Andreas Krause
LCTRTS
2010
Springer
16 years 1 months ago
Sampling-based program execution monitoring
For its high overall cost during product development, program debugging is an important aspect of system development. Debugging is a hard and complex activity, especially in time-...
Sebastian Fischmeister, Yanmeng Ba