Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
— In this paper, we present a new beamforming scheme for a downlink of multiuser multiple-input multipleoutput (MIMO) communication systems. Recently, a blockdiagonalization (BD)...
Sang-Rim Lee, Seokhwan Park, Sung Hyun Moon, Inkyu...
Automated detection and segmentation of nuclear and glandular structures is critical for classification and grading of prostate and breast cancer histopathology. In this paper, w...
Shivang Naik, Scott Doyle, Shannon Agner, Anant Ma...
Policy conflict analysis processes based solely on the examination of policy language constructs can not readily discern the semantics associated with the managed system for which ...
Level set methods have been proven to be efficient tools for tracing interface problems. Recently, some variants of the Osher- Sethian level set methods, which are called the Piece...