Current VLSI technology allows more than two wiring layers and the number is expected to rise in future. In this paper, we show that, by designing VLSI layouts directly for an L-l...
Chi-Hsiang Yeh, Emmanouel A. Varvarigos, Behrooz P...
We describe a new theoretical framework for robot-aided training of arm movements. This framework is based on recent studies of motor adaptation in human subjects and on general c...
Multilevel Fiduccia-Mattheyses MLFM hypergraph partitioning 3, 22, 24 is a fundamental optimization in VLSI CAD physical design. The leading implementation, hMetis 23 , has sinc...
Andrew E. Caldwell, Andrew B. Kahng, Igor L. Marko...
—Chemical–mechanical polishing (CMP) is an enabling technique used in deep-submicrometer VLSI manufacturing to achieve long range oxide planarization. Post-CMP oxide topography...
We consider the application of a channel state information (CSI) based multi-user (MU) multiple input multiple output (MIMO) scheme to the downlink of 3GPP Long Term Evolution (LT...