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ESWA
2008
166views more  ESWA 2008»
15 years 6 months ago
Modular design to support green life-cycle engineering
The severe competition in the market has driven enterprises to produce a wider variety of products to meet consumers' needs. However, frequent variation of product specificat...
Hwai-En Tseng, Chien-Chen Chang, Jia-Diann Li
SEUS
2009
IEEE
16 years 1 months ago
Exploring the Design Space for Network Protocol Stacks on Special-Purpose Embedded Systems
Many special-purpose embedded systems such as automobiles and aircrafts consist of multiple embedded controllers connected through embedded network interconnects. Such network inte...
Hyun-Wook Jin, Junbeom Yoo
ACMDIS
2008
ACM
15 years 8 months ago
TapGlance: designing a unified smartphone interface
The difference between using one mobile phone and another can feel like learning a new language based on our extensive experience designing mobile applications for spatial data na...
Daniel C. Robbins, Bongshin Lee, Roland Fernandez
TNN
2008
88views more  TNN 2008»
15 years 6 months ago
A New Approach to Knowledge-Based Design of Recurrent Neural Networks
Abstract-- A major drawback of artificial neural networks (ANNs) is their black-box character. This is especially true for recurrent neural networks (RNNs) because of their intrica...
Eyal Kolman, Michael Margaliot
162
Voted
ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 4 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang