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SLIP
2009
ACM
16 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
SLIP
2009
ACM
16 years 1 months ago
Prediction of high-performance on-chip global interconnection
Different interconnection structures have been proposed to solve the performance limitation caused by scaling of on-chip global wires. In this paper, we give an overview of curre...
Yulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin...
PERCOM
2006
ACM
16 years 26 days ago
Groupanizer: a Method to Correlate Multi-users Position with Daily Moments
Groupanizer is an extension of groupware and constitutes a development platform to integrate user-centric information for the benefit of groupware applications. User-centric conte...
Jean Olivier Caron, Yoshihiro Kawahara, Hiroyuki M...
MSWIM
2005
ACM
16 years 12 days ago
Application of synchronous dynamic encryption system in mobile wireless domains
Motivated by the tradeoff between security and efficiency performance parameters that has been imposed on all modern wireless security protocols, we designed a novel security syst...
Hamdy S. Soliman, Mohammed Omari
DSN
2003
IEEE
16 years 4 days ago
ICR: In-Cache Replication for Enhancing Data Cache Reliability
Processor caches already play a critical role in the performance of today’s computer systems. At the same time, the data integrity of words coming out of the caches can have ser...
Wei Zhang 0002, Sudhanva Gurumurthi, Mahmut T. Kan...