Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Different interconnection structures have been proposed to solve the performance limitation caused by scaling of on-chip global wires. In this paper, we give an overview of curre...
Yulei Zhang, Xiang Hu, Alina Deutsch, A. Ege Engin...
Groupanizer is an extension of groupware and constitutes a development platform to integrate user-centric information for the benefit of groupware applications. User-centric conte...
Jean Olivier Caron, Yoshihiro Kawahara, Hiroyuki M...
Motivated by the tradeoff between security and efficiency performance parameters that has been imposed on all modern wireless security protocols, we designed a novel security syst...
Processor caches already play a critical role in the performance of today’s computer systems. At the same time, the data integrity of words coming out of the caches can have ser...
Wei Zhang 0002, Sudhanva Gurumurthi, Mahmut T. Kan...