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DAC
2012
ACM
13 years 9 months ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
CODES
2007
IEEE
15 years 10 months ago
Synchronization after design refinements with sensitive delay elements
The synchronous computational model with its simple computation and communication mechanism makes it easy to describe, simulate and formally verify synchronous embedded systems at...
Tarvo Raudvere, Ingo Sander, Axel Jantsch
PADL
2009
Springer
16 years 7 months ago
Toward a Practical Module System for ACL2
Abstract. Boyer and Moore's ACL2 theorem prover combines firstorder applicative Common Lisp with a computational, first-order logic. While ACL2 has become popular and is being...
Carl Eastlund, Matthias Felleisen
PERCOM
2006
ACM
16 years 6 months ago
Pushing Doors for Modeling Contexts with OWL DL a Case Study
In this paper we present an integrated view for modeling and reasoning for context applications using OWL DL. In our case study, we describe a task driven approach to model typica...
Anni-Yasmin Turhan, Thomas Springer, Michael Berge...
ARC
2009
Springer
102views Hardware» more  ARC 2009»
16 years 1 months ago
A Parallel Branching Program Machine for Emulation of Sequential Circuits
The parallel branching program machine (PBM128) consists of 128 branching program machines (BMs) and a programmable interconnection. To represent logic functions on BMs, we use qua...
Hiroki Nakahara, Tsutomu Sasao, Munehiro Matsuura,...