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HPCA
2007
IEEE
16 years 7 months ago
Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
Kiran Puttaswamy, Gabriel H. Loh
HPCA
2007
IEEE
16 years 7 months ago
LogTM-SE: Decoupling Hardware Transactional Memory from Caches
This paper proposes a hardware transactional memory (HTM) system called LogTM Signature Edition (LogTM-SE). LogTM-SE uses signatures to summarize a transaction's readand writ...
Luke Yen, Jayaram Bobba, Michael R. Marty, Kevin E...
HPCA
2007
IEEE
16 years 7 months ago
A Low Overhead Fault Tolerant Coherence Protocol for CMP Architectures
It is widely accepted that transient failures will appear more frequently in chips designed in the near future due to several factors such as the increased integration scale. On t...
Ricardo Fernández Pascual, José M. G...
HPCA
2006
IEEE
16 years 7 months ago
Completely verifying memory consistency of test program executions
An important means of validating the design of commercial-grade shared memory multiprocessors is to run a large number of pseudo-random test programs on them. However, when intent...
Chaiyasit Manovit, Sudheendra Hangal
HPCA
2006
IEEE
16 years 7 months ago
LogTM: log-based transactional memory
Transactional memory (TM) simplifies parallel programming by guaranteeing that transactions appear to execute atomically and in isolation. Implementing these properties includes p...
Kevin E. Moore, Jayaram Bobba, Michelle J. Moravan...
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