Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
In this paper we study the problem of scheduling messages between two parallel machines connected by a low latency network during a data redistribution. We compare two approaches....
Many machine learning algorithms can be formulated as the minimization of a training criterion which involves (1) \training errors" on each training example and (2) some hype...
In this paper we propose a new method for extracting line segments from edge images. Our method basically follows a line segment grouping approach. This approach has many advantage...
Due to the advantages of easy re-configurability and scalability, the memory-based string matching architecture is widely adopted by network intrusion detection systems (NIDS). In...