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DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
DAC
2012
ACM
13 years 9 months ago
Equivalence checking for behaviorally synthesized pipelines
Loop pipelining is a critical transformation in behavioral synthesis. It is crucial to producing hardware designs with acceptable latency and throughput. However, it is a complex ...
Kecheng Hao, Sandip Ray, Fei Xie
ACL
2012
13 years 9 months ago
Fast Online Training with Frequency-Adaptive Learning Rates for Chinese Word Segmentation and New Word Detection
We present a joint model for Chinese word segmentation and new word detection. We present high dimensional new features, including word-based features and enriched edge (label-tra...
Xu Sun, Houfeng Wang, Wenjie Li
HPDC
2012
IEEE
13 years 9 months ago
Work stealing and persistence-based load balancers for iterative overdecomposed applications
Applications often involve iterative execution of identical or slowly evolving calculations. Such applications require incremental rebalancing to improve load balance across itera...
Jonathan Lifflander, Sriram Krishnamoorthy, Laxmik...
CVPR
2004
IEEE
16 years 9 months ago
Bayesian Assembly of 3D Axially Symmetric Shapes from Fragments
We present a complete system for the purpose of automatically assembling 3D pots given 3D measurements of their fragments commonly called sherds. A Bayesian approach is formulated...
Andrew R. Willis, David B. Cooper
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