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DAC
2010
ACM
15 years 10 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
AI
2006
Springer
15 years 6 months ago
Generating and evaluating evaluative arguments
Evaluative arguments are pervasive in natural human communication. In countless situations people attempt to advise or persuade their interlocutors that something is desirable (vs...
Giuseppe Carenini, Johanna D. Moore
MOBISYS
2008
ACM
16 years 5 months ago
Improving wireless privacy with an identifier-free link layer protocol
We present the design and evaluation of an 802.11-like wireless link layer protocol that obfuscates all transmitted bits to increase privacy. This includes explicit identifiers su...
Ben Greenstein, Damon McCoy, Jeffrey Pang, Tadayos...
ICS
2005
Tsinghua U.
15 years 11 months ago
System noise, OS clock ticks, and fine-grained parallel applications
As parallel jobs get bigger in size and finer in granularity, “system noise” is increasingly becoming a problem. In fact, fine-grained jobs on clusters with thousands of SMP...
Dan Tsafrir, Yoav Etsion, Dror G. Feitelson, Scott...
VISUALIZATION
1999
IEEE
15 years 10 months ago
Image Graphs - A Novel Approach to Visual Data Exploration
For types of data visualization where the cost of producing images is high, and the relationship between the rendering parameters and the image produced is less than obvious, a vi...
Kwan-Liu Ma