Complex embedded systems have always been heterogeneous multicore systems. Because of the tight constraints on power, performance and cost, this situation is not likely to change a...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
The ability to control the variations in IC fabrication process is rapidly diminishing as feature sizes continue towards the sub-100 nm regime. As a result, there is an increasing...
Sreeja Raj, Sarma B. K. Vrudhula, Janet Meiling Wa...
A new approa ch for pe r f or ma nc e -dr ive n r outi ng i n hi ghly c onge st e d hi gh s pe e d MCMs a nd PCBs i s pr e s e nt e d. Gl oba l r out i ng i s e mpl oye d t o ma n...
Correctly predicting the direction that branches will take is increasingly important in today’s wide-issue computer architectures. The name program-based branch prediction is gi...
Brad Calder, Dirk Grunwald, Donald C. Lindsay, Jam...