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170
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DAC
1999
ACM
16 years 7 months ago
1999
ACM
The many levels of metal used in aggressive deep submicron process technologies has made fast and accurate capacitance extraction of complicated 3-D geometries of conductors essen...
162
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GLVLSI
2009
IEEE
16 years 1 months ago
2009
IEEE
This paper proposes a scheme for automatic re-distribution layer (RDL) routing, which is used in chip-package connections. Traditional RDL routing designs are mostly performed man...
169
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DAGM
2009
Springer
16 years 1 months ago
2009
Springer
Abstract. Well known estimation techniques in computational geometry usually deal only with single geometric entities as unknown parameters and do not account for constrained obser...