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ASPDAC
2007
ACM
164views Hardware» more  ASPDAC 2007»
15 years 10 months ago
Thermal-Aware 3D IC Placement Via Transformation
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
Jason Cong, Guojie Luo, Jie Wei, Yan Zhang
DSN
2004
IEEE
15 years 10 months ago
The Recursive NanoBox Processor Grid: A Reliable System Architecture for Unreliable Nanotechnology Devices
Advanced molecular nanotechnology devices are expected to have exceedingly high transient fault rates and large numbers of inherent device defects compared to conventional CMOS de...
A. J. KleinOsowski, Kevin KleinOsowski, Vijay Rang...
FAABS
2000
Springer
15 years 10 months ago
Design and Mathematical Analysis of Agent-Based Systems
Abstract. Agent-based systems that are composed of simple locally interacting agents but which demonstrate complex group behavior o er several advantages over traditional multi-age...
Kristina Lerman
ATAL
2008
Springer
15 years 8 months ago
Multi agent based simulation of transport chains
An agent-based tool for micro-level simulation of transport chains (TAPAS) is described. It is more powerful than traditional approaches as it is able to capture the interactions ...
Paul Davidsson, Johan Holmgren, Jan A. Persson, Li...
CNSR
2005
IEEE
210views Communications» more  CNSR 2005»
15 years 8 months ago
A Framework for Self-Management of Hybrid Wireless Networks Using Autonomic Computing Principles
The dramatic increase in the number of mobile subscribers has put a significant resource and service provisioning strain on current cellular networks in particular in terms of mu...
Chong Shen, Dirk Pesch, James Irvine