Modeling DSP applications through coarse-grain dataflow graphs is popular in the DSP design community, and a growing set of rapid prototyping tools support such dataflow semantics...
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
The design and evaluation of microprocessor architectures is a difficult and time-consuming task. Although small, handcoded microbenchmarks can be used to accelerate performance e...
This work is motivated by the strong demand of reliability enhancement over flash memory. Our objective is to improve the endurance of flash memory with limited overhead and witho...
Recommender systems have been widely advocated as a way of coping with the problem of information overload for knowledge workers. Given this, multiple recommendation methods have ...