—This paper proposes a framework to maximize the lifetime the wireless sensor network (WSN) by using a mobile sink when the underlying applications tolerate delayed information d...
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
Mohit Pathak, Young-Joon Lee, Thomas Moon, Sung Ky...
Cold-start scenarios in recommender systems are situations in which no prior events, like ratings or clicks, are known for certain users or items. To compute predictions in such ca...
Zeno Gantner, Lucas Drumond, Christoph Freudenthal...
This paper deals with a wireless indoor positioning problem in which the location of a tag is estimated from range measurements taken by fixed beacons. The measurements may be affe...
Our previous paper presented a method for reducing adhesion forces by oscillation and showed the adhesion state can be checked by analyzing the data obtained by laser displacement ...