1346 search results - page 159 / 270 » Communication across cultures |
186
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DAC
2009
ACM
16 years 7 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
161
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ICS
2009
Tsinghua U.
16 years 1 months ago
2009
Tsinghua U.
Iterative stencil loops (ISLs) are used in many applications and tiling is a well-known technique to localize their computation. When ISLs are tiled across a parallel architecture...
178
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INFOCOM
2009
IEEE
16 years 1 months ago
2009
IEEE
—This paper considers the design of opportunistic packet schedulers for users sharing a time-varying wireless channel from the performance and the robustness points of view. Firs...
178
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DSRT
2008
IEEE
16 years 26 days ago
2008
IEEE
The DEVS formalism has been adopted and developed independently by many research teams, which led to various DEVS implementation versions. Consequently, different DEVS implementat...
177
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ICC
2007
IEEE
16 years 22 days ago
2007
IEEE
— – Major research challenges in the next generation of wireless networks include the provisioning of worldwide seamless mobility across heterogeneous wireless networks, the im...