Sciweavers

5334 search results - page 840 / 1067
» Communicating quantum processes
Sort
View
ICCAD
2008
IEEE
161views Hardware» more  ICCAD 2008»
16 years 3 months ago
A low-overhead fault tolerance scheme for TSV-based 3D network on chip links
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
ICCAD
2006
IEEE
108views Hardware» more  ICCAD 2006»
16 years 3 months ago
Formal model of data reuse analysis for hierarchical memory organizations
– In real-time data-dominated communication and multimedia processing applications, due to the manipulation of large sets of data, a multi-layer memory hierarchy is used to enhan...
Ilie I. Luican, Hongwei Zhu, Florin Balasa
ICCAD
2001
IEEE
91views Hardware» more  ICCAD 2001»
16 years 3 months ago
A System for Synthesizing Optimized FPGA Hardware from MATLAB
Efficient high level design tools that can map behavioral descriptions to FPGA architectures are one of the key requirements to fully leverage FPGA for high throughput computatio...
Malay Haldar, Anshuman Nayak, Alok N. Choudhary, P...
IUI
2010
ACM
16 years 3 months ago
Aspect-level news browsing: understanding news events from multiple viewpoints
Aspect-level news browsing provides readers with a classified view of news articles with different viewpoints. It facilitates active interactions with which readers easily discove...
Souneil Park, Sang Jeong Lee, Junehwa Song
CHI
2010
ACM
16 years 1 months ago
Friends only: examining a privacy-enhancing behavior in facebook
Privacy practices in social network sites often appear paradoxical, as content-sharing behavior stands in conflict with the need to reduce disclosure-related harms. In this study ...
Fred Stutzman, Jacob Kramer-Duffield