Abstract— This paper addresses the problem of solving finite word-length (bit-vector) arithmetic with applications to equivalence verification of arithmetic datapaths. Arithmet...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
– In real-time data-dominated communication and multimedia processing applications, due to the manipulation of large sets of data, a multi-layer memory hierarchy is used to enhan...
Efficient high level design tools that can map behavioral descriptions to FPGA architectures are one of the key requirements to fully leverage FPGA for high throughput computatio...
Malay Haldar, Anshuman Nayak, Alok N. Choudhary, P...
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