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DAC
2011
ACM
14 years 6 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
DAC
2006
ACM
16 years 7 months ago
Fast algorithms for slew constrained minimum cost buffering
As a prevalent constraint, sharp slew rate is often required in circuit design which causes a huge demand for buffering resources. This problem requires ultra-fast buffering techn...
Shiyan Hu, Charles J. Alpert, Jiang Hu, Shrirang K...
ISQED
2005
IEEE
81views Hardware» more  ISQED 2005»
16 years 13 hour ago
Exact Algorithms for Coupling Capacitance Minimization by Adding One Metal Layer
Due to the rapid development of manufacturing process technology and tight marketing schedule, the chip design and manufacturing always work toward an integrated solution to achie...
Hua Xiang, Kai-Yuan Chao, Martin D. F. Wong
EMSOFT
2007
Springer
15 years 10 months ago
A unified practical approach to stochastic DVS scheduling
This paper deals with energy-aware real-time system scheduling using dynamic voltage scaling (DVS) for energy-constrained embedded systems that execute variable and unpredictable ...
Ruibin Xu, Rami G. Melhem, Daniel Mossé
DSMML
2004
Springer
15 years 10 months ago
Efficient Communication by Breathing
The arithmetic-coding-based communication system, Dasher, can be driven by a one-dimensional continuous signal. A belt-mounted breath-mouse, delivering a signal related to lung vol...
Tom Shorrock, David MacKay, Chris Ball