All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Previous works on buffer planning are mainly based on fixed die placement. It is necessary to reduce the complexity of computing the feasible buffer insertion sites to integrate t...
Yuchun Ma, Xianlong Hong, Sheqin Dong, Song Chen, ...
—A key challenge in chip multiprocessor (CMP) design is to optimize the performance within a power budget limited by the CMP’s cooling, packaging, and power supply capacities. ...
Initial results of an experiment devised to combine Bond-Graph modeling and simulation with genetic programming for automated design of a simple mechatronic system are reported in...
Although the best processor design for executing a specific workload does depend on the characteristics of the workload, it can not be determined without factoring-in the effect o...