3002 search results - page 197 / 601 » Cloud Based Design Optimization |
152
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
An approach to robust system level mixed signal design is presented based on analog platforms. The bottom-up characterization phase of platform components provides accurate perfor...
154
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GLOBECOM
2009
IEEE
16 years 1 months ago
2009
IEEE
— In this paper, as a extended structure of the existing relay-destination joint minimum mean square error (MMSE) design, we propose a new source-relay-destination joint MMSE des...
157
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ICCAD
2009
IEEE
15 years 4 months ago
2009
IEEE
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
193
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VLSI
2010
Springer
15 years 5 months ago
2010
Springer
—In this paper, we introduce a design methodology to implement low-complexity and high-speed digital Finite Impulse Response (FIR) filters. Since FIR filters suffer from a larg...
181
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DAC
2008
ACM
16 years 7 months ago
2008
ACM
: Spin-Torque Transfer Magnetic RAM (STT MRAM) is a promising candidate for future universal memory. It combines the desirable attributes of current memory technologies such as SRA...