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DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
HASE
1998
IEEE
15 years 11 months ago
A New Heuristic to Discriminate between Transient and Intermittent Faults
Effective discrimination between transient and permanent faults is a very important practical problem in (dependable) system design. A count-andthreshold mechanism named -count, d...
Fabrizio Grandoni 0002, Andrea Bondavalli, Silvano...
CPHYSICS
2008
87views more  CPHYSICS 2008»
15 years 6 months ago
Molecular dynamics studies of swimming at the microscopic scale
The motion of two- and three-dimensional self-propelled microscopic bodies immersed in a fluid medium is studied using molecular dynamics simulation. The advantage of the atomisti...
D. C. Rapaport
ICAIL
2009
ACM
16 years 1 months ago
Integrating induction and deduction for finding evidence of discrimination
Automatic Decision Support Systems (DSS) are widely adopted for screening purposes in socially sensitive tasks, including access to credit, mortgage, insurance, labor market and o...
Dino Pedreschi, Salvatore Ruggieri, Franco Turini
PERCOM
2008
ACM
16 years 6 months ago
P2PNS: A Secure Distributed Name Service for P2PSIP
Decentralized Voice over IP networks are a promising alternative to classical server-based SIP networks especially in disaster areas or areas without centralized infrastructure. T...
Ingmar Baumgart