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DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
INFOCOM
1998
IEEE
15 years 11 months ago
An End-to-End Reliable Multicast Protocol Using Polling for Scaleability
Reliable sender-based one-to-many protocols do not scale well due mainly to implosion caused by excessive rate of feedback packets arriving from receivers. We show that this probl...
Marinho P. Barcellos, Paul D. Ezhilchelvan
ISCA
1998
IEEE
125views Hardware» more  ISCA 1998»
15 years 11 months ago
Active Pages: A Computation Model for Intelligent Memory
Microprocessors and memory systems su er from a growing gap in performance. We introduce Active Pages, a computation model which addresses this gap by shifting data-intensive comp...
Mark Oskin, Frederic T. Chong, Timothy Sherwood
ASPDAC
1998
ACM
160views Hardware» more  ASPDAC 1998»
15 years 11 months ago
Synthesis of Power Efficient Systems-on-Silicon
We developed a new modular synthesis approach for design of low-power core-based data-intensive application-specific systems on silicon. The power optimization is conducted in th...
Darko Kirovski, Chunho Lee, Miodrag Potkonjak, Wil...
ISLPED
1997
ACM
130views Hardware» more  ISLPED 1997»
15 years 11 months ago
Analytical energy dissipation models for low-power caches
We present detailed analytical models for estimating the energy dissipation in conventional caches as well as low energy cache architectures. The analytical models use the run tim...
Milind B. Kamble, Kanad Ghose