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DAC
2009
ACM
16 years 7 months ago
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
In this paper, we present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing,...
Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang
DAC
2009
ACM
16 years 7 months ago
Enabling adaptability through elastic clocks
Power and performance benefits of scaling are lost to worst case margins as uncertainty of device characteristics is increasing. Adaptive techniques can dynamically adjust the mar...
Emre Tuncer, Jordi Cortadella, Luciano Lavagno
DAC
2008
ACM
16 years 7 months ago
A progressive-ILP based routing algorithm for cross-referencing biochips
Due to recent advances in microfluidics technology, digital microfluidic biochips and their associated CAD problems have gained much attention, most of which has been devoted to d...
Ping-Hung Yuh, Sachin S. Sapatnekar, Chia-Lin Yang...
DAC
2007
ACM
16 years 7 months ago
Dynamic Power Management with Hybrid Power Sources
DPM (Dynamic Power Management) is an effective technique for reducing the energy consumption of embedded systems that is based on migrating to a low power state when possible. Whi...
Jianli Zhuo, Chaitali Chakrabarti, Kyungsoo Lee, N...
DAC
2007
ACM
16 years 7 months ago
Endurance Enhancement of Flash-Memory Storage, Systems: An Efficient Static Wear Leveling Design
This work is motivated by the strong demand of reliability enhancement over flash memory. Our objective is to improve the endurance of flash memory with limited overhead and witho...
Yuan-Hao Chang, Jen-Wei Hsieh, Tei-Wei Kuo