— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
Young-Joon Lee, Yoon Jo Kim, Gang Huang, Muhannad ...
Abstract—This paper investigates Orthogonal FrequencyDivision Multiple-Access (OFDMA) resource-allocation schemes for two-hop relays in a home Powerline Communication (PLC) netwo...
—In this paper, quality of service (QoS) provisioning for voice service over cognitive radio networks is considered. As voice traffic is sensitive to delay, the presence of prim...
—An important challenge in mobile sensor networks is to enable energy-efficient communication over a diversity of distances while being robust to wireless effects caused by node...
Jeremy Gummeson, Deepak Ganesan, Mark D. Corner, P...
—We investigate an architecture for multi-Gigabit outdoor mesh networks operating in the unlicensed 60 GHz “millimeter (mm) wave” band. In this band, the use of narrow beams ...