A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...
In large-scale, self-organized and distributed systems, such as peer-to-peer (P2P) overlays and wireless sensor networks (WSN), a small proportion of nodes are likely to be more c...
Varying illumination condition is a challenging problem for face recognition and synthesis. The illumination re-rendering technique allows aligning the illumination effects of fac...
Jianyi Liu, Nanning Zheng, Lei Xiong, Gaofeng Meng...
The problem of finding the most appropriate subset of features or regressors is the generic challenge of Machine Learning problems like regression estimation or pattern recognitio...
Most of vision-based algorithms for motion and localization estimation requires matching some interest points in a pair of images. After building feature correspondence, it is pos...