In the presented article we discuss and detail the general methodological approaches, the reconstruction strategies and the techniques that have been employed to achieve the 3D in...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Objects often define usage protocols that clients must follow in order for these objects to work properly. Aliasing makes it notoriously difficult to check whether clients and i...
Various new imaging techniques have been used at the C2RMF, in order to digitize paintings and objects. These techniques are used for extensive and detailed non-destructive analys...
Truly successful models for component-based software development continue to prove elusive. One of the few is the use of operating system, database and similar programs in many sy...