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IJCV
2012
13 years 9 months ago
Pre-organizing Shape Instances for Landmark-Based Shape Correspondence
Brent C. Munsell, Andrew Temlyakov, Martin Styner,...
3DIC
2009
IEEE
138views Hardware» more  3DIC 2009»
16 years 2 months ago
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, Dav...
DATE
2005
IEEE
120views Hardware» more  DATE 2005»
16 years 27 days ago
Why Systems-on-Chip Needs More UML like a Hole in the Head
Let’s be clear from the outset: SoC can most certainly make use of UML; SoC just doesn’t need more UML, or even all of it. The advent of model mappings, coupled with marks tha...
Stephen J. Mellor, John R. Wolfe, Campbell McCausl...