— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
As technologies evolve and computer systems shrink to the size of matchboxes, also their field of application shifts in new directions. Our permanent companions, mobile phones, p...
Christian Bertelsmeyer, Erik Koch, Alexander H. Sc...
When designing a software module or system, a systems engineer must consider and differentiate between how the system responds to external and internal errors. External errors can...
Current Radio Frequency Identification (RFID) systems generally have long design times and low tolerance to changes in specification. This paper describes a field programmable,...
Alex K. Jones, Raymond R. Hoare, Swapna R. Donthar...
We give the first study of copy detection techniques for VLSI CAD applications; these techniques are complementary to previous watermarking-based IP protection methods in finding ...
Andrew B. Kahng, Darko Kirovski, Stefanus Mantik, ...