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» Buffer Insertion for Noise and Delay Optimization
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ISQED
2009
IEEE
94views Hardware» more  ISQED 2009»
16 years 26 days ago
Simultaneous buffer and interlayer via planning for 3D floorplanning
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong
GLVLSI
2009
IEEE
155views VLSI» more  GLVLSI 2009»
16 years 24 days ago
Buffer design and optimization for lut-based structured ASIC design styles
The interconnection delay of pre-fabricated design style dominates circuit delay due to the heavily downstream capacitance. Buffer insertion is a widely used technique to split o...
Po-Yang Hsu, Shu-Ting Lee, Fu-Wei Chen, Yi-Yu Liu
ISQED
2002
IEEE
126views Hardware» more  ISQED 2002»
15 years 11 months ago
Formulae for Performance Optimization and Their Applications to Interconnect-Driven Floorplanning
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance. Buffer insertion/sizing and wire sizing are ...
Nicholas Chia-Yuan Chang, Yao-Wen Chang, Iris Hui-...
ICCAD
2001
IEEE
152views Hardware» more  ICCAD 2001»
16 years 2 months ago
Hybrid Structured Clock Network Construction
This paper hierarchically constructs a hybrid mesh/tree clock network structure consisting of overlying zero-skew clock meshes, with underlying zero-skew clock trees originating f...
Haihua Su, Sachin S. Sapatnekar
DAC
2011
ACM
14 years 5 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...