1343 search results - page 186 / 269 » Bounded-lifetime integrated circuits |
181
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ISLPED
2006
ACM
16 years 12 days ago
2006
ACM
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
151
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DATE
2010
IEEE
15 years 11 months ago
2010
IEEE
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
155
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DFT
1999
IEEE
15 years 10 months ago
1999
IEEE
A programmable single-chip multiprocessor system for video coding has been developed. The system is implemented in a high-performance 0.25 m logic/embedded DRAM process. It integr...
164
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FPGA
2009
ACM
16 years 1 months ago
2009
ACM
Aggressive scaling increases the number of devices we can integrate per square millimeter but makes it increasingly difficult to guarantee that each device fabricated has the inte...
176
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...