A block-level placement and routing scheme called Fishbone is presented. The routing uses a two-layer spine topology. The pin locations are configurable and restricted to certain ...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
In this paper, we present the design of a P4 (Power-PerformanceProcess-Parasitic) aware voltage controlled oscillator (VCO) at nanoCMOS technologies. Through simulations, we have ...
In-network processing is recommended for many sensor network applications to reduce communication and improve energy efficiency. However, constraints on memory, speed, and energy ...
Brandon Rumberg, David W. Graham, Vinod Kulathuman...
Abstract--The design of high integrity, area efficient power distribution grids has become of practical importance as the portion of on-chip interconnect resources dedicated to pow...