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DAC
2011
ACM
14 years 6 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
ISPD
2012
ACM
234views Hardware» more  ISPD 2012»
14 years 2 months ago
MAPLE: multilevel adaptive placement for mixed-size designs
We propose a new multilevel framework for large-scale placement called MAPLE that respects utilization constraints, handles movable macros and guides the transition between global...
Myung-Chul Kim, Natarajan Viswanathan, Charles J. ...
DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
ICPR
2004
IEEE
16 years 7 months ago
From Massively Parallel Image Processors to Fault-Tolerant Nanocomputers
Parallel processors such as SIMD computers have been successfully used in various areas of high performance image and data processing. Due to their characteristics of highly regula...
Jie Han, Pieter Jonker
DAC
2003
ACM
16 years 7 months ago
Random walks in a supply network
This paper presents a power grid analyzer based on a random walk technique. A linear-time algorithm is first demonstrated for DC analysis, and is then extended to perform transien...
Haifeng Qian, Sani R. Nassif, Sachin S. Sapatnekar