This paper accurately considers wire short defects and proposes an algorithm to guarantee IC chip yield rate improvement for redundant wire insertion. Without considering yield ra...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
Three-phase shunt active power filter (APF) is often used to compensate the harmonic and reactive current derived from non-linear load. But many non-ideal factors, such as the lim...
The selective use of carry-save arithmetic, where appropriate, can accelerate a variety of arithmetic-dominated circuits. Carry-save arithmetic occurs naturally in a variety of DSP...
Hadi Parandeh-Afshar, Ajay K. Verma, Philip Brisk,...
The recent multi/many-core CPUs or GPUs have provided an ideal parallel computing platform to accelerate the timeconsuming analysis of radio-frequency/millimeter-wave (RF/ MM) int...
Xuexin Liu, Hao Yu, Jacob Relles, Sheldon X.-D. Ta...